Polished Surface Wolfram Copper Alloy Plates

• Application: Electronics, Industrial
• Standard: GB, ASTM
• Purity: 75% W, 25% Cu
• Alloy: Alloy
• Shape: Bars, Plates
• Type: Tunsten Copper Plates
• Surface: Polished / Machined
• Density: 14.5g/cm3
• Transport Package: Plywood Boxes Inside with Foam Plates
• Specification: ISO9001: 2000
• Trademark: SHIBO
• Origin: Henan, China
• HS Code: 81019990
• Production Capacity: 600tons/Year

Product Description

Polished tungsten copper alloy plates

Tungsten copper alloy is the composite of tungsten and copper which own the excellent 

performance of tungsten and copper. It is used widely in such industries as engine, electric 

power, electron, metallurgy, spaceflight and aviation.

Specification:
W/Cu: W(50-90%)/Cu(10-50%)
Thickness: 5 - 200mm
Width: 5 - 200mm
Length: 10 - 500mm
Surface: Ground, polished

Character:
1.better heat resistant;
2.better ablate-resistant;
3.high intensity    
4.high density;
5.excellent thermal and electrical conductivity;
6.easy to be machined.

Application:
1) Arcing contacts and vaccum contacts in high and medium voltage breakers or vaccum interruptors
2) Electrodes in electric spark erosion cutting machines
3) Heat sinks as passive cooling elements of electronic devices
4) Electrodes for Resistance Welding
 

Brand and NO.	Chemical components%			Physical properties
	Cu	Total impurities ≤	W	Density (g/cm³) ≥	Hardness HB ≥	Resistivity (µΩ·cm) ≤	Conductivity IACS%≥	Bending strength Mpa≥
CuW(50)	50±2.0	0.5	Bal.	11.85	115	3.2	54
CuW(55)	45±2.0	0.5	Bal.	12.30	125	3.5	49
CuW(60)	40±2.0	0.5	Bal.	12.75	140	3.7	47
CuW(65)	35±2.0	0.5	Bal.	13.30	155	3.9	44
CuW(70)	30±2.0	0.5	Bal.	13.80	175	4.1	42	790
CuW(75)	25±2.0	0.5	Bal.	14.50	195	4.5	38	885
CuW(80)	20±2.0	0.5	Bal.	15.15	220	5.0	34	980
CuW(85)	15±2.0	0.5	Bal.	15.90	240	5.7	30	1080
CuW(90)	10±2.0	0.5	Bal.	16.75	260	6.5	27	1160